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Construction
Electronics and Electrical
Industrial
Tooling
RAMPF Board
Polydur System
Thai Epoxy
Floor

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Porduct Code Mix Ratio Properties/Description
MR1168A/B A:B=100£º10 UL APPROVED, low viscosity, good for encapsulation & casting
MR1178 A/B A:B=100£º20 UL APPROVED, low viscosity, good for encapsulation & casting
MR2908 A/B A:B=2:1 UL APPROVED encapsulation system
MR177 A/B A:B=5:1 Filled, non-flexible general casting system
for encapsulation,black
MR177-35 A/B A:B=10:3.3 Medium hard, contains minerals
MR178-2 A/B A:B=2:1 general casting resin, relatively flexible,
suitable for encapsulation of
electrical/electronic components
MR1953-52 A/B A:B=5:1 Suitble for automatic filling system
MR9880 /MH 818 A:B=100£º25 High U presure resistance, can meet temperture rapidly change
YDC6006/TH7269 A:B=10:1»ò10£º0.9 low visicosity, room temperture curing; used in low pressure casting
YDC6004/TH7653 A:B=100:100 room temperture curing; used in low ~ middle pressure casting
YDC 6015/TH7652 P A:B=100£º80 room temperture curing; used in middle ~high pressure casting
YDHW 184 M1/ TH 7356P A:B=100£º20 room temperture curing; used in outdoor's casting
MR 9837
MH 8836
A:B=100£º20 room temperture curing; used in outdoor's casting, UV resistance.
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